In April 2026, Embode facilitated a Field Visit for AIM Progress members visiting Malaysia to TS Packaging (TSP), a leading flexible packaging and printing supply chain business who have completed a journey with the Ganapati Initiative, Embode’s supplier capability building programme.
Corporate sustainability leads came together to sit with TSP and hear about how they took on board Embode’s support and implemented improvements through Ganapati. These included the improvement of their contracting standards, tackling fee payments as well as how they invested their time and effort in building their team capabilities.
We appreciated TSP’s frankness in explaining what they found challenging and how they had to adapt. All in all, it was wonderful to see how change works on the ground with employers.
A huge thanks to the TSP team for opening their doors and hosting a collaborative and insightful field visit!
Read more about the interview we conducted with Mr. Vincent Oh, Executive Director at TS Packaging here.
